EFD Flux Paste EFD RA Special, 10cc

More active than the E-6412 flux paste. RA- Rosin Activated.

Flux paste for special applications.

Leaves a residue. A good cleaner required to remove residue. e.g. MCC-SPR

Plunger also available on request P/N 01E-580170-PLR

EFD 6-410 Rosin Activated (RA) flux is designed for both dispensing and printing. It offers up to eight (8) hours of print life and four (4) hours of tack time. It offers exceptional lot-to-lot consistency with excellent dispense and print resolution and reproducibility.
RA flux residue is light amber in colour, transparent, and soft. Cleaning with an appropriate cleaning system is required for most products.
FluxPlus dispensable and printable paste fluxes are designed to meet a wide variety of fluxing needs and are formulated to perform well with all dispensing and printing technologies in use today. Electronic assembly applications include BGA/PGA sphere and pin attachment, BGA and other rework, and fluxing of pre-bumped flip chips and solder pads.
Quality
EFD paste fluxes meet or exceed IPC Joint Industry standards J-STD-004 for flux.
Material Properties
J-STD-004
Classification ROM0
Copper Mirror No Breakthrough
Silver Chromate Pass
Fluoride Spot Pass
Corrosion None
SIR 24 hours* 8.1 x 10 Ohms
SIR 96 hours* 1.3 x 10E11 Ohms
SIR 168 hours* 1.3 x 10E11 Ohms
Physical Properties Acid Value
(ASTM D-465-82) 80 +/- 10
Colour Amber
Specific Gravity 0.95 +/- 0.05
Percent Solids 72 +/- 2%
Penetration Value
(ASTM D-937-92) 140 +/- 25 mm

Storage and Handling
Store between 4 Deg C and 21deg CC (40 Find 70F). Do not Freeze. Allow four (4) hours at room temperature before using.
Exposure to temperatures in excess of 27degrees C may cause chemical decomposition. When not in use, containers
should be kept closed.
Guarantee
EFD paste fluxes have a guaranteed shelf life of six (6) months from date of shipment when stored and handled as
recommended.
Safety
Read the MSDS prior to use. Care should be taken to prevent accidental ingestion and contact with the eyes.
Use adequate ventilation and avoid breathing soldering fumes. Wash hands thoroughly after use.
Technical Support
Our Product Specialists and Technical Service Team are available to evaluate your process requirements and develop a soldering solution with you.
Application Guidelines
Deposition
Best Working Environment
20degrees C to 25 degrees C (68F to 77F) at 35% to 60% Relative Humidity
Fluxing Process Ref: FluxPlus Fluxing Guide
Reflow
Heating Guideline Max 330oC
Cleaning
Solvents
Ref: Flux Residue Removal Guide**
Rosin Activated
Residue is corrosive and designed to be easily removed with a solvent cleaning process.
* Nominal/Typical values
** EFD does not sell or recommend specific solvents
but collaborates with any solvent vendor, eg. Microcare MCC-SPR