Multicore X33-12i is a no clean, resin free, halide free liquid flux for surfaces with poor solderability.
Maximum process window and sustained activity - without resin
High speed soldering on conventional leaded and SMD components - no bridges or icicles
Good through hole penetration
No cleaning - reduces costs
Minimal residues to interfere with ATE probes without cleaning
Compatible with rosin and OSP based surface preservatives
Foam, spray or wave application
Colour: Colourless
Smell: Alcoholic
Solids content: 2.9%
Halide content: Zero
Acid value (on liquid) mg KOH/g: 22.5
Specific gravity at 25°C (77°F): 0.810
Flashpoint (Abel): 12°C (53°F)
Thinners: PC70i
IPC-TM-650 Copper Mirror Test: Pass
J-STD-004 classification: ORM0
EN 29454 classification: 2.2.3
Pack Size: 1Litre
