MG Solder Paste, Leaded, No-Clean 35G

MG Solder Paste No Clean 250G
Type 3 (45>25 µm)

MG Chemicals Sn63/Pb37 No Clean Solder Paste is made from a blend of virgin high purity non-recycled Tin and Lead metal powder blended
with a No Clean flux to form a paste. Designed for surface mount applications, it provides high tack force and good wettability. The post
soldering transparent residues are non-conductive, non-corrosive and highly insulated. The name no clean refers to the fact that the flux
residues are not harmful to assemblies and does not mean there will be no residues.

MG Chemicals Sn63/Pb37 No Clean Solder Paste Features & Benefits
* No clean formula
* Low residues
* Excellent wettability
* Non-corrosive flux residue
* Non-conductive flux residue
* J-STD-006C compliant
* Melting point: 183 °C / 361 °F

4860. TDS