QuickBGA Reballing Reflow Oven

Quick 3000 reflow soldering kit uses black infrared heating and a closed loop sensor to ensure temperature stability and stable temperature control.
The lower heater is a ceramic tile generating black infrared, while the upper heater is made in the technology of infrared fluorescent lamps.
This combination ensures maximum minimization of temperature differences on the BGA object and protects it from damage due to overheating and against so-called cold solder.

Mains voltage: 220 ~ 240V AC 50Hz
Upper heating section: 500W
Lower heating section: 400W
Temperature range: 50 ° C ~ 300 ° C
Programmed process parameters: 10 groups
Workspace: 130 × 130 [mm]
Weight: 9kg
Dimensions: 355 × 225 × 180 [mm]

1. Based on the principle of dark infrared heating, the equipment has closed-loop temperature control, precise and stable temperature and small fluctuation. With dark infrared ceramic plate heating at the bottom and high-infrared heating tube at the top, it has an extremely long service life. It minimizes the lateral temperature difference of B G A to prevent cold soldering or overheating damage of BGA.

2. Designed with an observation window, allowing real-time observation for the melting of the BGA chip solder ball, and the BGA in different specifications soldered simultaneously.

3. A sound and light alarm is provided when the heating cabinet is opened during soldering.

4. When the cabinet is opened after the process ends, the cooling fan works automatically; when the cabinet is closed, the cooling fan also stops working.

5. The panel is equipped with an external K-type sensor to monitor the actual temperature of BGA.