Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics
Easily removes solder from components or pads on a circuit board
Concentrated fine copper braiding utilizes less length of wick for each desoldering application
Made of clean, oxide-free copper wire; tight weave enables quick "on and off" desoldering
5 & 10 lengths spooled on static dissipative bobbins in compliance with ESD Association Standard
Flux residue on board does not need to be cleaned
To be used in conjunction with processes using RMA type no-clean fluxes
Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes
