FOAM, STATFREE, HIGH DENSITY 1/8IN, 24IN x 36IN
* Antistatic, low tribocharging
Minimizes charge generation; material will conduct charges if grounded
* Dissipative - corrosion resistant
Ideal for long term storage
* Uniform protection
Will not affect the solder ability of device leads
* Lead-free RoHS Compliant
* Made in America
High Density Foam is ideal for lead insertion packaging, providing ESD and
physical protection to component leads, and bringing terminals to
equipotential, minimizing exposure to discharge.
Size: 24" x 36"
Volume Resistivity: 10E3 - 10E5 ohms
Surface Resistivity: 10E3 - 10E5 ohms
