Solder: Leaded and Lead-Free Wire, Bar, Paste & More

MG Chemicals SAC305 T3 No Clean Solder Paste is made from a blend of virgin high purity non-recycled Tin, Silver and Copper metal powder mixed with a No clean flux to form a paste. It is a lead-free, no clean, halogen-free solder paste designed specifically with robust flux activity and enhanced printing characteristics for ultra fine pitch applications. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.

In addition it offers repeatable, consistent printing characteristics combined with long stencil and tack life to accommodate high speed printing. This material yields excellent printing capabilities across various board designs and ultra-fine pitch down to 0.3mm pitch with excellent paste release to achieve brick like print results.

MG Chemicals SAC305 T3 No Clean Solder Paste Features & Benefits

No clean formula
Enhanced print characteristics utilizing proprietary paste flux manufacturing techniques
Non-corrosive
Thermal stability
Shiny and bright solder joints
Low hard non-conductive-tacky residues
Long Tack time
Excellent wettability
Suitable with air or nitrogen atmosphere
Meets J-STD-005A
Complies with RoHS Directive 2002/95/EC
Melting point: 217 °C - 221 °C / 423 °C - 430 °F