Loctite DAM7010C ECCOBOND 30cc

LOCTITE ECCOBOND DAM 7010C is a black epoxy semiconductor encapsulant, formulated to be used in combination with a "fill" encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant.
It is specially designed for glob top, chip on board applications where protection of wire bonded bare IC is required.
This two material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.

LOCTITE ECCOBOND DAM 7010C has good crack, chemical and thermal resistance along with low thermal expansion.
This SVHC free, REACH compliant, high purity, low sag material operates at -40 to 150ºC and is typically used for glob top applications and the encapsulation of bare wire bonded semiconductors.
30 cc

ECCOBOND_DAM_7010C_TDS TDS loctite-eccobond-dam7010c-fil7010c