Loctite FIL7010C ECCOBOND 30cc

LOCTITE ECCOBOND FIL 7010C is a low viscosity, one component, SVHC free, epoxy product designed for use as a potting or encapsulation resin protection for stress sensitive electronic components. It is specially formulated with a low thermal expansion and high Tg, along with a toughened polymer backbone making it ideally suited to survive severe thermal shock conditions with a high resistance to micro cracking.

LOCTITE ECCOBOND FIL 7010C is a REACH compliant product, designed to survive constant service temperatures of 150°C, with peak temperatures of up to 180°C for chip on board encapsulation.

Cure Schedule

2 hours @ 140°C
1 hour @ 100°C plus 1 hour @ 150°C (Low Stress)
30cc

MOQ 10

LOCTITE-ECCOBOND-FIL-7010C-TDS TDS loctite-eccobond-dam7010c-fil7010c